3D Printing Innovations

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3D Printing Innovations

Journal Type: 国际期刊
Language: 英文刊
Category: 工程技术
Publish Cycle: 半年刊
Review Cycle: 7个工作日
Publish Model: 开放获取（OA）
Publish Country: 英国
Char/Page Requirement: 3版（5000字符）
ISSN: 2755-6301（O）
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Journal Introduction

3D Printing Innovations (3DPI) is a peer-reviewed, gold open access journal committed to advancing the science, engineering, and real-world applications of additive manufacturing (AM) technologies. The journal provides an international and interdisciplinary platform for researchers, engineers, and practitioners to share original research, technical breakthroughs, and practical case studies that are shaping the future of digital manufacturing. We welcome submissions that explore the entire ecosystem of additive manufacturing — from fundamental process development and novel materials to industrial applications and socio-economic impacts. The journal aims to bridge academic inquiry with industrial innovation, encouraging contributions that demonstrate cross-disciplinary integration and real-world relevance.

Topics

Topics include, but are not limited to: Additive manufacturing processes and technologies Materials development (polymers, metals, ceramics, composites, and bio-inks) Design for additive manufacturing (DfAM), generative design, and topology optimization Modeling, simulation, and control of 3D printing processes Hardware and software innovation in AM systems Quality assurance, testing methods, and process standardization Applications of 3D printing in: -Biomedical and healthcare (e.g., implants, prosthetics, drug delivery) -Aerospace, automotive, and energy industries -Architecture and construction (e.g., printed housing, structural components) -Consumer goods and electronics -Education, arts, and cultural heritage preservation Smart manufacturing, automation, and AI integration in AM Sustainability, lifecycle analysis, and circular economy in 3D printing Policy, regulation, and economic studies related to AM adoption 3D Printing Innovations actively encourages interdisciplinary contributions that connect AM technologies with fields such as robotics, artificial intelligence, materials science, biomedicine, and environmental studies.

Editorial Board

No editorial board information available.

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